| 摘要 |
PROBLEM TO BE SOLVED: To provide a wafer polishing device which is capable of surely holding a polished semiconductor wafer in a wafer loading hollow provided to a disk and surely polishing the semiconductor wafer. SOLUTION: In a wafer polishing device, semiconductor wafers 5 are each loaded into a loading hollow 4 provided to a metal disk 2, a polishing disk is made to bear against the surfaces of the semiconductor wafers 5 which are uncovered in the openings of the wafer loading hollows 4 while the metal disk 2 is rotated. A synthetic resin protective ring 7 is internally provided along the inner circumferential edge of each wafer loading hollow 4, outward protruding teeth 8 provided to the outer circumferential edge of the ring 7 are so set as to be engaged with inward protruding teeth 9 provided to the inner circumferential edge of the wafer loading hollow 4, and the outward protruding teeth 8 are engaged with the inward protruding teeth 9 to form a first sloping pair 10 which prevents the ring 7 from coming out upward from the wafer loading hollow 4 and a second sloping pair 11 which prevents the ring 7 from coming out downward from the wafer loading hollow 4. |
