| 摘要 |
PROBLEM TO BE SOLVED: To provide a semiconductor package that is inexpensive and has a multipin region although a lead frame thinner than before is used. SOLUTION: The semiconductor package has a semiconductor device 13 that is mounted onto a die pad 12 supported by a suspension lead of a lead frame 10, a wire 15 for electrically connecting an electrode on the upper surface of the semiconductor device 13 to an inner lead tip section 14, and a sealing resin 6 for sealing the enclosed region of the semiconductor device including the wire 15. In this case, a smell section 17a that is set to be a connection terminal is alternately provided on the extension of the inner lead 17 for each adjacent inner lead 17, at the same time, a solder resist 18 where merely a portion that is set to be a connection terminal section is opened is provided on the back of the package, and a solder land 19 is provided in the opening. A thin material with a plate thickness of 0.1 mm is used in a lead frame material, and a compact region that cannot be covered with QFN and has at least 100 pins can be achieved inexpensively.
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