发明名称 ELECTRONIC COMPONENT MOUNTING DEVICE
摘要 PROBLEM TO BE SOLVED: To obtain an electronic component mounting device which can evade mis-sucking and mis-mounting of an electronic component as much as possible. SOLUTION: The electronic component mounting device is equipped with a rotary body 144 which is held by a holder rotatably on a horizontal axis, and a plurality of suction nozzles 100 held in a plurality of nozzle holding holes 150 formed radially in the rotary body 144. The rotary body 144 has pilot type direction selector valves 194 arranged corresponding to the respective nozzle holding holes 150, and is equipped with a pilot pressure controller 220 which supplies the electronic component mounting device to the pilot type direction selector valves 194. The pilot type direction selector valve 194 is switched by using the rotation of the rotary body 144 for positioning the suction nozzles 100 at the component suction and mounting position. An electromagnetic direction selector valve 256 controls the switching of supply of positive pressure to 1st and 2nd pilot pressure ports 250 and 252 constituting the pilot pressure controller 220.
申请公布号 JP2003110290(A) 申请公布日期 2003.04.11
申请号 JP20010300433 申请日期 2001.09.28
申请人 FUJI MACH MFG CO LTD 发明人 TERUI SEIICHI
分类号 B25J15/06;H05K13/04 主分类号 B25J15/06
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