发明名称 FOAMING CONDUCTIVITY VANISHING MATERIAL, FUSE AND THERMAL SENSITIVE CURRENT INTERRUPTING METHOD
摘要 PROBLEM TO BE SOLVED: To provide a foaming conductivity vanishing material capable of lowering conductivity by heated. SOLUTION: This foaming conductivity vanishing material is a conductive material containing at least a resin, a conductive substance, and a heat-forming type forming agent, and its feature is that conductivity is lowered by heat- foaming. The heat-foaming type forming agent may be a thermally expansive micro-sphere. It is preferable that the foaming conductivity vanishing material has a filmy configuration. The foaming conductivity vanishing material can be used as a fuse.
申请公布号 JP2003109428(A) 申请公布日期 2003.04.11
申请号 JP20010299785 申请日期 2001.09.28
申请人 NITTO DENKO CORP 发明人 ARIMITSU YUKIO;OSHIMA TOSHIYUKI;MURATA SHUTO;KIUCHI KAZUYUKI;SATO MASAAKI
分类号 C08J9/04;H01B1/20;H01H37/76;H01H85/06;(IPC1-7):H01B1/20 主分类号 C08J9/04
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