发明名称 |
FOAMING CONDUCTIVITY VANISHING MATERIAL, FUSE AND THERMAL SENSITIVE CURRENT INTERRUPTING METHOD |
摘要 |
PROBLEM TO BE SOLVED: To provide a foaming conductivity vanishing material capable of lowering conductivity by heated. SOLUTION: This foaming conductivity vanishing material is a conductive material containing at least a resin, a conductive substance, and a heat-forming type forming agent, and its feature is that conductivity is lowered by heat- foaming. The heat-foaming type forming agent may be a thermally expansive micro-sphere. It is preferable that the foaming conductivity vanishing material has a filmy configuration. The foaming conductivity vanishing material can be used as a fuse.
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申请公布号 |
JP2003109428(A) |
申请公布日期 |
2003.04.11 |
申请号 |
JP20010299785 |
申请日期 |
2001.09.28 |
申请人 |
NITTO DENKO CORP |
发明人 |
ARIMITSU YUKIO;OSHIMA TOSHIYUKI;MURATA SHUTO;KIUCHI KAZUYUKI;SATO MASAAKI |
分类号 |
C08J9/04;H01B1/20;H01H37/76;H01H85/06;(IPC1-7):H01B1/20 |
主分类号 |
C08J9/04 |
代理机构 |
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代理人 |
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主权项 |
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地址 |
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