| 摘要 |
PROBLEM TO BE SOLVED: To provide a semiconductor device which can be protected against swelling and cracking due stage shift or expansion of steam or a bubble. SOLUTION: In order to prevent stage shift of a die pad 5 due to molding pressure of a hot pressed sealing resin 2 in a resin sealed semiconductor device 1, the die pad 5 is provided with a through hole 8 for discharging steam and bubbles being generated on the interface of a semiconductor chip 9, the die pad 5, and the sealing resin 2 at the time of mounting the semiconductor device 1. A column 6 having a through hole 7 communicating with the through hole 8 is provided on the lower surface of the die pad 5. |
