SEMICONDUCTOR PACKAGE

摘要

PURPOSE: A semiconductor package is provided to disperse the heat generated by hot spot uniformly over the whole CPU chip and alleviate the thermal stress between a lid and thermal interface material. CONSTITUTION: A CPU chip(120) is bonded onto a wiring substrate(110). A lid is attached onto the upper surface(112) of the substrate, including a CPU chip inside it. Thermal interface material(156) lies between the lid and the chip. External connection pins(130) protrudes under the bottom surface of the substrate, electrically connected to the chip. The outside surface of the chip except the active surface is covered by a thermal dispersion case(160) made up of diamond or graphite or synthetic silicon with thermal conductivity of 1000mW/mK and thermal expansion coefficient of below 4.0.