发明名称 COMPOSITE WIRING BOARD AND MANUFACTURING METHOD THEREOF
摘要 PROBLEM TO BE SOLVED: To provide an inexpensive and reliable composite wiring board suitable for high-density wiring, and to provide a method for manufacturing the composite wiring board. SOLUTION: In the composite wiring board, a hard printed-wiring board 7 having a wiring layer at least at one side and a flexible wiring board 1 having a wiring layer at least at one side are laminated via an insulating resin bonding sheet 5 having a conductive pillar 6 that is provided so that the wiring layers of both the boards are electrically connected. Additionally, in the composite wiring board and the manufacturing method thereof, an entire wiring pattern is divided into at least two wiring regions including a high-density wiring region and other wiring regions, and the flexible wiring board 1 should be laminated in the high-density wiring region.
申请公布号 JP2003110240(A) 申请公布日期 2003.04.11
申请号 JP20010305541 申请日期 2001.10.01
申请人 SUMITOMO METAL MINING CO LTD 发明人 KUDO YASUTO
分类号 H05K3/46;(IPC1-7):H05K3/46 主分类号 H05K3/46
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