CIRCUIT BOARD, REMOVING METHOD OF FLUX AND ELECTRIC CIRCUIT BOARD

摘要

PROBLEM TO BE SOLVED: To prevent the existence of a flux residue on the surface of an insulator between the electrodes of a soldered electronic circuit board, by flow soldering/mounting electronic parts and flow-removing the flux of any type with a solder jet instead of processing the flux residue of the electronic circuit board. SOLUTION: Flux is applied to the circuit board where a slipping angle on the surface of the insulator is improved to become smaller than a peculiar slipping angle on the surface of the insulator. Flux bonded to the surface of the insulator in the circuit board is easily removed from the surface of the insulator. Then, flux bonded to the surface of the insulator on the circuit board is made to flow away with the solder jet at the time of flow soldering.