发明名称 PREASSEMBLED BOARD
摘要 PROBLEM TO BE SOLVED: To provide a preassembled board which can be readily mounted on electronic equipment when electronic equipment requiring a plurality of types of printed boards is assembled. SOLUTION: This preassembled board 1 is constituted by a frame 5 and a plurality of printed boards 2-4 connected to the frame 5 with a mold runners 7. The types of the printed boards 2-4 are different from one another. The printed boards 2-4 are connected to one another with flexible boards 6. Accordingly, when the frame 5 is removed from the preassembled board 1, the printed boards can be mounted on an electronic component as they are.
申请公布号 JP2003110204(A) 申请公布日期 2003.04.11
申请号 JP20010306474 申请日期 2001.10.02
申请人 IBIDEN CO LTD 发明人 KOSAKA KATSUMI
分类号 H05K1/02;H05K1/14;H05K3/00;(IPC1-7):H05K1/02 主分类号 H05K1/02
代理机构 代理人
主权项
地址