| 摘要 |
<p>A thermosetting resin composition which contains as a binder a thermosetting resin having a storage elastic modulus at 20°C of 1,000 MPa or lower and an elongation at 20°C of 10% or higher and contains an inorganic filler in an amount of 100 to 2,000 parts by weight per 100 parts by weight of the binder. The thermosetting resin composition and the resin film can combine a low modulus, high elongation, and low coefficient of thermal expansion.</p> |
