发明名称 FLUX AND SOLDER COMPRISING THE FLUX
摘要 PURPOSE: A flux in which characteristics required for flux remnants after soldering are sufficiently satisfied even in the ordinary environment, and desired characteristics are maintained even in the specific environment, and a solder comprising the flux are provided. CONSTITUTION: The flux comprises 100 to 60 wt.% of fatty acid; and 40 to 0 wt.% of one or more compounds selected from the group consisting of paraffin, castor oil, polyamide, rosin, resin, fatty acid ether, fatty acid amide, nitrocellulose, ethylcellulose, cellulose acetate butyrate (CAB), butylated melanin, urea, and formalin resin, wherein the fatty acid is lauric acid, myristic acid, palmitic acid and stearic acid, wherein the fatty acid is palmitic acid, and wherein the compound is paraffin. The flux comprises 0.1 to 30 wt.% of flux comprising 100 to 60 wt.% of fatty acid, and 40 to 0 wt.% of one or more compounds selected from the group consisting of paraffin, castor oil, polyamide, rosin, resin, fatty acid ether, fatty acid amide, nitrocellulose, ethylcellulose, cellulose acetate butyrate (CAB), butylated melanin, urea, and formalin resin; 10 to 40 wt.% of one or more compounds selected from glycol derivative, aromatic hydrocarbon, ester, and alcohol; and a balance of resin. The flux comprises 0.1 to 30 wt.% of flux comprising 100 to 60 wt.% of fatty acid, and 40 to 0 wt.% of one or more compounds selected from the group consisting of paraffin, castor oil, polyamide, rosin, resin, fatty acid ether, fatty acid amide, nitrocellulose, ethylcellulose, cellulose acetate butyrate (CAB), butylated melanin, urea, and formalin resin; and 99.9 to 70 wt.% of resin.
申请公布号 KR20030028803(A) 申请公布日期 2003.04.10
申请号 KR20030018808 申请日期 2003.03.26
申请人 SKYNICS INC. 发明人 HA, GWAN SEOK;ISHIKAWA, HISAO;KOJIMA, MASAO
分类号 B23K35/363;H05K3/34;(IPC1-7):B23K35/363 主分类号 B23K35/363
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