发明名称 MATCHING DEVICE AND PLASMA PROCESSING APPARATUS
摘要 A matching device includes first branched waveguides (71A to 71C) connected vertically to the axis (Z) of a cylindrical waveguide (14) and having one end opening into the cylindrical waveguide (14) and the other end shortcircuited and second branched waveguides (73A to 73C). The first branched waveguides (71A to 71C) are arranged at a predetermined interval in the direction of the axis (Z) of the cylindrical waveguide (14). The second branched waveguides (73A to 73C) are arranged at a position to define 90 degrees with respect to the arrangement position of the first branched waveguides (71A to 71C) and at a predetermined interval in the direction of the axis (Z) of the cylindrical waveguide (14). With this configuration, it is possible to accurately and easily control the impedance matching between the supply side and load side of the cylindrical waveguide (14).
申请公布号 WO03030294(A1) 申请公布日期 2003.04.10
申请号 WO2002JP10075 申请日期 2002.09.27
申请人 TOKYO ELECTRON LIMITED;NIHON KOSHUHA CO., LTD.;ISHII, NOBUO;SHINOHARA, KIBATSU 发明人 ISHII, NOBUO;SHINOHARA, KIBATSU
分类号 H05H1/46;H01J37/32;H01L21/205;H01L21/302;H01L21/3065;H01L21/31;H01P5/04;(IPC1-7):H01P5/04 主分类号 H05H1/46
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