发明名称 Plasma processing system and surface processing method
摘要 To provide a plasma processing system capable of introducing a uniform microwave into a plasma processing chamber irrespective of conditions, and a surface processing method using the same. A plasma processing system in which air in a plasma processing chamber is exhausted by an exhaust unit, a microwave is supplied to the plasma processing chamber through an annular waveguide which is bored to be provided at predetermined intervals in a circumferential direction on the same plane facing a surface to be processed of an object to be processed on the plasma processing chamber side to generate plasma within the plasma processing chamber, wherein the annular waveguide is separated into two layers of an input side waveguide and an output side waveguide, and the slots are bored to be provided between these waveguides at predetermined intervals in a circumferential direction.
申请公布号 US2003066487(A1) 申请公布日期 2003.04.10
申请号 US20020259729 申请日期 2002.09.30
申请人 SUZUKI NOBUMASA 发明人 SUZUKI NOBUMASA
分类号 H05H1/46;B01J19/08;C23C16/511;H01J37/32;H01L21/00;H01L21/205;H01L21/265;H01L21/302;H01L21/3065;H01L21/31;H01L21/311;H01L21/316;H01L21/318;(IPC1-7):C23F1/00;C03C15/00;B44C1/22;C23C16/00 主分类号 H05H1/46
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