发明名称 Verfahren zur Herstellung einer Lotverbindung
摘要 <p>The invention relates to a method for the production of a soldered connection between at least two contact partners (22, 23) of a contact arrangement (21), whereby a moulded piece of soldering material (27) is arranged at a separation from the contact arrangement, an at least partial fusion of the soldering material piece occurs, and the at least partly fused soldering material slips against the contact arrangement such that both contact partners are wetted thereby to form an electrically-conducting connection in a connector region.</p>
申请公布号 DE10145420(A1) 申请公布日期 2003.04.10
申请号 DE2001145420 申请日期 2001.09.14
申请人 SMART PAC GMBH TECHNOLOGY SERVICES 发明人 AZDASHT, GHASSEM
分类号 B23K1/005;B23K3/06;H01L21/48;H01L21/60;H05K3/34;(IPC1-7):B23K3/06 主分类号 B23K1/005
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