发明名称 Surface mountable device
摘要 The present invention discloses a surface mountable device comprising a current-sensitive element and two electrodes. The current-sensitive element is composed of a PTC conductive composite, comprising at least one polymer and a conductive filler. The feature of the present invention is that the current-sensitive element is a three-dimensional bent structure so that the shape, length and height of the device can be varied according to the space of the circuit board and the resistance of the surface mountable device. Therefore, the mountable surface of the circuit board can be used more efficiently. Moreover, the area of the current-sensitive element of the present invention is larger than that of the conventional surface mountable device. Consequently, the normal resistance of the surface mountable device of the present invention is smaller than that of the conventional surface mountable device and the voltage endurance of the surface mountable device of the present invention is increased.
申请公布号 US2003067054(A1) 申请公布日期 2003.04.10
申请号 US20020265540 申请日期 2002.10.07
申请人 CHU EDWARD FU-HUA;WANG DAVID SHAU-CHEW;MA YUN-CHING 发明人 CHU EDWARD FU-HUA;WANG DAVID SHAU-CHEW;MA YUN-CHING
分类号 H01C1/02;H01C1/14;H01C7/02;H01G4/00;H01L21/8242;(IPC1-7):H01G4/00 主分类号 H01C1/02
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