发明名称 |
Under bump metallization pad and solder bump connections |
摘要 |
The present invention relates to an improved method of forming and structure for under bump metallurgy ("UBM") pads for a flip chip which reduces the number of metal layers and requires the use of only a single passivation layer to form, thus eliminating a masking step required in typical prior art processes. The method also includes repatterning bond pad locations.
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申请公布号 |
US2003067073(A1) |
申请公布日期 |
2003.04.10 |
申请号 |
US20020288419 |
申请日期 |
2002.11.06 |
申请人 |
AKRAM SALMAN;WOOD ALAN G. |
发明人 |
AKRAM SALMAN;WOOD ALAN G. |
分类号 |
H01L21/60;H01L23/485;(IPC1-7):H01L21/44;H01L23/52;H01L29/40;H01L23/48 |
主分类号 |
H01L21/60 |
代理机构 |
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代理人 |
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主权项 |
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地址 |
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