| 摘要 |
A connection component for making microelectronic assemblies includes a dielectric structural layer having a first surface and a plurality of conductive leads having first and second ends overlying the first surface of the dielectric structural layer. An adhesive is provided between the second ends of the leads and the dielectric structural layer such that the adhesive forms connections between the second ends of the leads and the structural layer. The formed connections have areas smaller than the areas of the second ends. The second ends of the leads are releasably attached to the structural layer by the connections. Thus, the second ends of the leads may be engaged with features on a microelectronic device and the microelectronic elements may be moved away from the structural layer so as to bend the second ends of the leads away from the structural layer. |
