| 摘要 |
Sides of via hole do not bow horizontally, thereby preventing an increase of a resistance of a wiring layer connected to a conductor in the via hole. A semiconductor device comprises a first wiring layer, an insulating layer over the first wiring, a second wiring on the insulating layer, a first hole formed in the first wiring, a second hole formed in the insulating layer connecting with at least a part of the first hole, and a conductive material in first and second holes that electrically connects the first wiring layer to the second wiring layer.
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