发明名称 SOLDERED HEAT SINK ANCHOR AND METHOD OF USE
摘要 <p>An anchoring mechanism and method are provided for securing a component to a printed circuit board. The anchoring mechanism may include a loop, a first leg extending from the loop, and a second leg extending from the loop. The first leg may mount through a first hole of the printed circuit board and include a compressible section to compress when inserted into the first hole and to expand after passing through the first hole. THe compressible section of the first leg may support solder between the anchoring mechanism and the first hole. Likewise, the second leg may mount through a second hole of the printed circuit board and include a compressible section to compress when inserted into the second hole and to expand after passing through the second hole. The compressible section of the second leg may support solder between the anchoring mechanism and the second hole.</p>
申请公布号 WO2003030257(A2) 申请公布日期 2003.04.10
申请号 US2002025306 申请日期 2002.08.08
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