METHOD FOR FORMING RESIN FILM AND METHOD FOR MANUFACTURING ELECTRONIC PARTS

摘要

A method for forming a resin film which comprises a step of subjecting a resin material to vapor deposition through heating the resin material at a temperature higher than the melting point of the resin material under a reduced pressure, wherein the resin material preferably has a viscosity average molecular weight of 500 to 1,000,000 a method for manufacturing electronic parts which comprises a step of forming a resin film by the use of the above method. The method for forming a resin film allows the preparation of a thin resin film with good controllability.