发明名称 Pad conditioner coupling and end effector for a chemical mechanical planarization system and method therefor
摘要 A pad conditioner coupling (58) holds an end effector (57) for abrading a polishing media surface. Pad conditioning planarizes the polishing media surface, removes particulates, and roughens the polishing media surface to promote the transport of polishing slurry. Pad conditioner coupling (58) comprises shoulder screws (50), polymer bearings (51), a static plate (52), a wave spring (54), and a floating plate (55). Wave spring (54) is placed between static plate (52) and floating plate (55). The shoulder screws (50) connect through the static plate (52) and fasten to the floating plate (55) to hold the wave spring (54) in a preloaded condition. The polymer bearings (51) prevent the shoulder screws (50) from contacting the static plate (52). Wave spring (54) allows the floating plate (55) to move in a non-parallel position to the static plate (52) for angular compensation in the pad conditioning process.
申请公布号 US2003068963(A1) 申请公布日期 2003.04.10
申请号 US20020298744 申请日期 2002.11.18
申请人 VANELL JAMES F. 发明人 VANELL JAMES F.
分类号 B24B37/04;B24B57/02;(IPC1-7):B24B7/00;B24B9/00 主分类号 B24B37/04
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