发明名称 |
Vorrichtung zum Verlöten von Kontakten auf Halbleiterchips |
摘要 |
According to the invention, a chip (4), maintained on a chip support (13) by means of a mandrel (1) is heated by a radiation source (12) on the side opposite to the wafer (2) so as to melt an input soldering metal applied on one side opposite to the wafer. A cleaning device (5) comprising a plate (6) provided with a slot (7), a gas channel (8) and a gas evacuation port (14) located proximate to the slot and designed for a forming gas is placed parallel to the wafer. The chip is moved vertically relative to the wafer, compressed on the wafer through the slot and soldered by isothermal solidification. |
申请公布号 |
DE10147789(A1) |
申请公布日期 |
2003.04.10 |
申请号 |
DE2001147789 |
申请日期 |
2001.09.27 |
申请人 |
INFINEON TECHNOLOGIES AG |
发明人 |
HUEBNER, HOLGER;BERGMANN, ROBERT |
分类号 |
B23K1/00;B23K1/005;B23K1/008;B23K1/012;B23K3/08;F24C7/00;F26B19/00;H01L21/00;H01L21/58;H01L21/60;H01L21/603;H05K3/34;H05K13/04 |
主分类号 |
B23K1/00 |
代理机构 |
|
代理人 |
|
主权项 |
|
地址 |
|