| 摘要 |
PURPOSE: A plating bath and a method for improving deposition of a metal on a substrate by including aldehydes in the plating bath that prevent the degradation of plating bath components are provided. CONSTITUTION: The metal plating bath comprises an additive consumption inhibiting aldehyde, and a salt of a metal selected from the group consisting of copper, gold, silver, palladium, platinum, cobalt, cadmium, chromium, bismuth, indium, rhodium, ruthenium, and iridium, wherein the aldehyde comprises an aromatic or non-aromatic aldehyde, and wherein the additive consumption inhibiting aldehyde has a formula 1, R¬1-CH, where R1 is (C1-C20) linear, branched or cyclic alkyl; (C2-C20) linear, branched or cyclic alkenyl; (C2-C20) linear or branched alkynyl; (C1-C20) alkyl-O(C2-C3O)xR2; (C1-C12)alkylphenyl-O(C2-C3O)xR2; or -phenyl-O(C2-C3O)xR2; where x is an integer of from 1 to 500 and R2 is hydrogen, (C1-C4) alkyl or phenyl; the (C1-C20) alkyl, (C2-C20) alkenyl, and (C2-C20) alkynyl may be unsubstituted or substituted.
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