| 发明名称 |
Forming solder walls and interconnects on a substrate |
| 摘要 |
Formation of solder walls on a substrate. Solder walls and interconnects are formed on a substrate by placing solder preforms on the substrate, covering the substrate and preforms with a vented top plate which is not solder wettable and is held apart from the substrate by spacers, and reflowing the solder.
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| 申请公布号 |
US2003068839(A1) |
申请公布日期 |
2003.04.10 |
| 申请号 |
US20010972695 |
申请日期 |
2001.10.04 |
| 申请人 |
CULURIS ALLEN CHRIS;STEPHENS JAMES PHILIP |
发明人 |
CULURIS ALLEN CHRIS;STEPHENS JAMES PHILIP |
| 分类号 |
H01L21/48;H01L21/50;H05K3/34;(IPC1-7):H01L21/44 |
主分类号 |
H01L21/48 |
| 代理机构 |
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代理人 |
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