| 摘要 |
A semiconductor die package (30) includes a plurality of conductive leads (11) and a multi-layer structure (10) for carrying electrical signals, the multi-layer structure (10) including a plurality of layers of insulative material (12a-12d), each of the layers including a first surface and a second surface on an opposing side of the layer. Each of the leads (11) extends into a corresponding well (15) extending completely through at least one of the layers and bottoming at one of the surfaces of one of the layers through which the well (15) does not extend and is electrically coupled to an electrically conductive bonding structure (13) formed within its corresponding well (15). <IMAGE> |
