发明名称 |
Apparatus and method for packaging circuits |
摘要 |
Methods for forming an edge contact on a die and edge contact structures are described. The edge contacts on the die do not increase the height of the die. The edge contacts are positioned on the periphery of a die. The edge contacts are positioned in the saw streets. Each edge contact is connected to one bond pad of each die adjacent the saw street. The edge contact is divided into contacts for each adjacent die when the dies are separated. In an embodiment, a recess is formed in the saw street. In an embodiment, the recess is formed by scribing the saw street with a mechanical cutter. The recess is patterned and contact material is deposited to form the edge contacts. |
申请公布号 |
US2003067001(A1) |
申请公布日期 |
2003.04.10 |
申请号 |
US20020118576 |
申请日期 |
2002.04.08 |
申请人 |
MICRON TECHNOLOGY, INC. |
发明人 |
POO CHIN YONG;JEUNG BOON SUAN;WAF LOW SIU;YU CHAN MIN;LOO NEO YONG;KOON ENG MEOW;LENG SER BOK;KWANG CHUA SWEE;CHUNG SO CHEE;SENG HO KWOK |
分类号 |
H01L21/301;H01L21/60;H01L21/78;H01L23/04;H01L23/48;H01L23/485;H01L23/50;H01L23/52;H01L23/58;(IPC1-7):H01L23/58 |
主分类号 |
H01L21/301 |
代理机构 |
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代理人 |
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主权项 |
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地址 |
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