发明名称 |
SMALL FORMAT OPTICAL SUBASSEMBLY |
摘要 |
A small format optoelectronic package or device includes a non-electrically conductive substrate partially covered by an electrically conductive can. The electrically conductive can has a transparent element affixed to an aperture of the electrically conductive can. The electrically conductive can encloses and hermetically seals an edge emitting optical diode, a reflecting mirror, a monitor diode, and conductors between the electrically conductive can and the non-electrically conductive substrate. The non-electrically conductive substrate has three through-holes formed through a thickness of the non-electrically conductive substrate. The three through-holes are filled with an electrically conductive material so as to form three electrically conductive vias. Additionally, a surface of the non-electrically conductive substrate is organized into three regions. The first and third regions have the electrically conductive plating material applied thereto.
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申请公布号 |
US2003067951(A1) |
申请公布日期 |
2003.04.10 |
申请号 |
US20010826480 |
申请日期 |
2001.04.05 |
申请人 |
GILLILAND PATRICK B.;JINES CARLOS;DWARKIN ROBERT M. |
发明人 |
GILLILAND PATRICK B.;JINES CARLOS;DWARKIN ROBERT M. |
分类号 |
H01S5/022;(IPC1-7):H01S3/04 |
主分类号 |
H01S5/022 |
代理机构 |
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代理人 |
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主权项 |
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地址 |
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