| 摘要 |
PROBLEM TO BE SOLVED: To provide a pressure-sensitive adhesive sheet for reinforcing electronic parts with which electronic parts such as a thin-layered semiconductor wafer are reinforced, and in which damages in producing step and in assembling step of parts, and the like, are prevented, and is free from floating, peeling, and the like, originated form bubbles, voids, and the like, in high-temperature heating. SOLUTION: The pressure-sensitive adhesive sheet for reinforcing electronic parts has an adhesive layer formed on at least one side of a supporter, wherein this adhesive layer is a photopolymerized compound of a photopolymerizable composition composed of (a) a monomer mixture of 100 pts.wt. composed of mainly an alkyl (meth)acrylate having a 2-14C alkyl group on average and a monoethylenic unsaturated acid of 1-30 wt.% capable of copolymerizing with the above alkyl (meth)acrylate, (b) a polyfunctional (meth)acrylaet of 0.02-5 pts.wt. as a cross-bonding agent, (C) a photopolymerization initiator of 0.01-4 pts.wt., and (d) an epoxy resin of 5-30 pts.wt.
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