发明名称 HIGHLY CONDUCTIVE RESIN MOLDING AND ITS MANUFACTURING METHOD
摘要 PROBLEM TO BE SOLVED: To provide a highly conductive resin molding which has excellent moldability and which can be inexpensively manufactured and to provide a method for efficiently manufacturing the same. SOLUTION: The highly conductive resin molding is made of a highly conductive resin composition in which a conducting agent is added to the resin. The molding comprises a cut part formed on a contact surface part necessary to at least conduct. Thus, the part having the highly conductive part is exposed.
申请公布号 JP2003103529(A) 申请公布日期 2003.04.09
申请号 JP20020162706 申请日期 2002.06.04
申请人 TORAY IND INC 发明人 UMETSU HIDEYUKI;SHINODA FUMIE;MAKABE YOSHIKI
分类号 B29C37/00;B29K67/00;B29K105/16;B29K507/04;H01B5/16;H01B13/00;(IPC1-7):B29C37/00 主分类号 B29C37/00
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