发明名称 |
HIGHLY CONDUCTIVE RESIN MOLDING AND ITS MANUFACTURING METHOD |
摘要 |
PROBLEM TO BE SOLVED: To provide a highly conductive resin molding which has excellent moldability and which can be inexpensively manufactured and to provide a method for efficiently manufacturing the same. SOLUTION: The highly conductive resin molding is made of a highly conductive resin composition in which a conducting agent is added to the resin. The molding comprises a cut part formed on a contact surface part necessary to at least conduct. Thus, the part having the highly conductive part is exposed. |
申请公布号 |
JP2003103529(A) |
申请公布日期 |
2003.04.09 |
申请号 |
JP20020162706 |
申请日期 |
2002.06.04 |
申请人 |
TORAY IND INC |
发明人 |
UMETSU HIDEYUKI;SHINODA FUMIE;MAKABE YOSHIKI |
分类号 |
B29C37/00;B29K67/00;B29K105/16;B29K507/04;H01B5/16;H01B13/00;(IPC1-7):B29C37/00 |
主分类号 |
B29C37/00 |
代理机构 |
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代理人 |
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主权项 |
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地址 |
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