发明名称 METHOD AND APPARATUS FOR SCATTERING SPACER
摘要 PROBLEM TO BE SOLVED: To smoothly remove a substrate, on which spacers are scattered, from a stage without disturbing the scattered state in the case of scattering the spacers to the substrate. SOLUTION: In the spacer scattering apparatus that scatters spacers onto the substrate 2 held by suction on the stage 1 in a chamber 4, when the scattered state of the spacers onto the substrate 2 is defective, a changeover device 8 selects a position of increasing the suction holding force exerted on the substrate 2 on the stage 1 and a cleaner 10 sucks and removes the spacers 3 on the substrate 2 strongly sucked. Since the suction holding force exerted to the substrate 2 in the stage 1 is increased only when the spacers 3 whose scattering state is defective are removed, the substrate 2 on which the spacers are normally scattered is held on the stage 1 with a smaller suction holding force. Thus, a vacuum destructive force exerted when the substrate 2 is removed is small, production of new static electricity is reduced and disturbance of the distribution of the spacers properly scattered can be avoided.
申请公布号 JP2003107488(A) 申请公布日期 2003.04.09
申请号 JP20010298680 申请日期 2001.09.27
申请人 SHIBAURA MECHATRONICS CORP 发明人 MASUKO NAOKI;TAKAHASHI TAKASHI
分类号 G02F1/1339;(IPC1-7):G02F1/133 主分类号 G02F1/1339
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