发明名称 |
HEAT CONDUCTIVE PRESSURE SENSITIVE ADHESIVE, HEAT CONDUCTIVE PRESSURE SENSITIVE ADHESIVE SHEET AND ITS LAMINATE |
摘要 |
PROBLEM TO BE SOLVED: To obtain a heat conductive pressure sensitive adhesive excellent in heat conductive performance and having flexibility, shape followingness and good adhesiveness, and to provide a heat conductive pressure sensitive adhesive sheet and a laminate using the sheet. SOLUTION: The adhesive comprises (a) a copolymer of 50-97 pts.wt. which contains an alkyl acrylate having a 2-18C alkyl group, (b) a compound of 3-50 pts.wt. which is not compatible with the copolymer (a) and has a melting point of 40-80 deg.C and (c) a heat conductive particulate of 10-500 pts.wt.
|
申请公布号 |
JP2003105299(A) |
申请公布日期 |
2003.04.09 |
申请号 |
JP20010302346 |
申请日期 |
2001.09.28 |
申请人 |
SEKISUI CHEM CO LTD |
发明人 |
TOGAWA KATSUYA;AZUMA KENICHI;HYOZU SHUNJI |
分类号 |
C09J7/00;C09J11/04;C09J11/06;C09J133/08;(IPC1-7):C09J133/08 |
主分类号 |
C09J7/00 |
代理机构 |
|
代理人 |
|
主权项 |
|
地址 |
|