发明名称 HEAT CONDUCTIVE PRESSURE SENSITIVE ADHESIVE, HEAT CONDUCTIVE PRESSURE SENSITIVE ADHESIVE SHEET AND ITS LAMINATE
摘要 PROBLEM TO BE SOLVED: To obtain a heat conductive pressure sensitive adhesive excellent in heat conductive performance and having flexibility, shape followingness and good adhesiveness, and to provide a heat conductive pressure sensitive adhesive sheet and a laminate using the sheet. SOLUTION: The adhesive comprises (a) a copolymer of 50-97 pts.wt. which contains an alkyl acrylate having a 2-18C alkyl group, (b) a compound of 3-50 pts.wt. which is not compatible with the copolymer (a) and has a melting point of 40-80 deg.C and (c) a heat conductive particulate of 10-500 pts.wt.
申请公布号 JP2003105299(A) 申请公布日期 2003.04.09
申请号 JP20010302346 申请日期 2001.09.28
申请人 SEKISUI CHEM CO LTD 发明人 TOGAWA KATSUYA;AZUMA KENICHI;HYOZU SHUNJI
分类号 C09J7/00;C09J11/04;C09J11/06;C09J133/08;(IPC1-7):C09J133/08 主分类号 C09J7/00
代理机构 代理人
主权项
地址