LAMINATED BODY, ITS MANUFACTURING METHOD, AND METHOD FOR MANUFACTURING WIRING BOARD

摘要

PROBLEM TO BE SOLVED: To provide a wiring board which can cope with densification more cheaply by forming the wiring board by using a laminated foil having a barrier layer to utilize a both surfaces-exposing technique and a selective etching technique. SOLUTION: On both side surfaces of the laminated foil comprising the barrier layer composed of a metal or an alloy which is different in etching characteristics from Cu or Cu alloy and a first conductor layer and a second conductor layer which comprise the Cu or Cu alloy formed on both sides of the barrier layer, a first masking layer and a second masking layer which comprise a metal or an alloy different in etching characteristics from the Cu or the Cu alloy are formed by being registered with each other to provide a laminated body.