SEMICONDUCTOR DEVICE MANUFACTURING METHOD

摘要

PROBLEM TO BE SOLVED: To store a warping semiconductor wafer in a cassette. SOLUTION: The warp of the semiconductor wafer 1 in a warping condition can be temporarily corrected to be flat by spraying a dry air 4c around a central portion of a main surface 1a of the semiconductor wafer 1. Easy suction to a pincette 3 is therefore allowed, with the result that the semiconductor wafer 1 can be stored in an empty cassette.