发明名称 EPOXY RESIN COMPOSITION AND SEMICONDUCTOR DEVICE
摘要 PROBLEM TO BE SOLVED: To provide an epoxy resin composition having flame retardance, reflowing reliability such as adhesion and blistering properties on reflowing and filling properties on molding. SOLUTION: The epoxy resin composition comprises (A) an epoxy resin, (B) a curing agent, and (C) a filler, and the above epoxy resin (A) contains a tetramethylbisphenol F type epoxy resin to be represented by formula (I) ; simultaneously the content of a bromine compound based on the entire composition is <=0.3 wt.% and the content of an antimony compound based on the entire composition is <=0.3 wt.%; and furthermore the ratio of the filler (C) based on the entire composition is more than 87 wt.% to not more than 98 wt.%.
申请公布号 JP2003105175(A) 申请公布日期 2003.04.09
申请号 JP20010303535 申请日期 2001.09.28
申请人 TORAY IND INC 发明人 OTSU TAKASHI;TABATA AKIHIRO;TSUJI YOSHIYUKI
分类号 C08L63/02;C08G59/62;C08K3/00;C08K3/22;C08K5/06;C08K5/136;C08L101/04;H01L23/29;H01L23/31;(IPC1-7):C08L63/02 主分类号 C08L63/02
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