发明名称 GLASS CERAMIC MATERIAL FOR MULTILAYER WIRING BOARD
摘要 PROBLEM TO BE SOLVED: To provide a glass ceramic material for a multilayer wiring board which is simultaneously burnable with Ag or Cu, has a low specific dielectric constant and its temperature coefficient τε adjustable within a range of -60 ppm/ deg.C to +60 ppm/ deg.C, and suitable for the use in a high frequency spectrum. SOLUTION: This glass ceramic material includes a borosilicate glass, TiO2 and an oxide filler (SiO2 ), and the composition of these components is within a range surrounded with five straight lines obtained by joining a point A[92(borosilicate glass)/1.5(TiO2 )/6.5(SiO2 )], B(92/5/3), C(79/18/3), D(50/18/32) and E(50/1.5/48.5) in this order in a triangular figure in which the composition range of each component is shown in a volume percentage.
申请公布号 JP2003104773(A) 申请公布日期 2003.04.09
申请号 JP20010299787 申请日期 2001.09.28
申请人 TAIYO YUDEN CO LTD 发明人 KASUYA YUICHI;KAWAMURA KEIZO;TSUJIKU KOICHIRO
分类号 C04B35/14;C04B35/16;H05K3/46 主分类号 C04B35/14
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