| 摘要 |
PROBLEM TO BE SOLVED: To solve problems that the heat generated when an optical semiconductor element is operated cannot be efficiently radiated outside, and the optical semiconductor element is thermally broken. SOLUTION: A high-temperature heat conductive substrate 1 is formed by impregnating copper in a sintered porous body consisting of molybdenum powder with the mean grain size of 50 to 100μm containing no particles of the grain size of <=25μm, and has the composition consisting of, by weight, 75-95% sintered porous body and 5-25% copper. By using this substrate for a package for accommodating the optical semiconductor element, the heat is efficiently radiated outside via the substrate 1 even when the optical semiconductor element 4 emits much heat during the operation, the temperature of the optical semiconductor element 4 is constantly kept adequate by, and the optical semiconductor element 4 can be stably and normally operated for a long time. |
