| 摘要 |
PROBLEM TO BE SOLVED: To provide a conductive material having an excellent adhesion property of a metallic film. SOLUTION: The conductive material having the excellent adhesion property of the metallic film is obtained by imparting a cationic compound, such as an amine compound or ammonium salt compound, to a base material, then imparting a tannic acid thereto, thereafter subjecting the material to an electroless plating treatment.
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