| 摘要 |
PROBLEM TO BE SOLVED: To provide an epoxy resin composition for semiconductor sealing which does not cause gold line flow and hardly warps after molding or during soldering. SOLUTION: This area-mounting type epoxy resin composition for semiconductor sealing contains (A) a triphenolmethane-type epoxy resin, (B) a triphenolmethane-type phenol resin, (C) fused silica, and (D) a cure accelerator which is a molecular associate of a tetrasubstituted phosphonium (X) with a compound (Y) having at least two phenolic hydroxyl groups and a conjugate base of a compound (Y) having at least two hydroxyl groups. The compound (Y) is selected from among dihydroxybenzenes, trihydroxybenzenes, and bisphenols. The conjugate base is a phenoxide compound formed by removing a hydrogen atom from the compound (Y).
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