摘要 |
The present invention relates to a solution and to a method of treating copper surfaces, the copper surfaces being brought into contact with an acidic treatment liquid which contains hydrogen peroxide and at least one five-membered heterocyclic compound as well as additionally at least one microstructure modifying agent selected from the group comprising thioles A, disulfides B, sulfides C and thioamides D having the following respective general formulae: wherein R<SUP>1 </SUP>and R<SUP>2</SUP>=alkyl, alkenyl, aryl, aralkyl, especially benzyl, cycloalkyl and the derivatives thereof and R<SUP>3</SUP>=R<SUP>1</SUP>, R<SUP>1</SUP>-O, R<SUP>1</SUP>-S, amino or substituted amino, wherein R<SUP>1 </SUP>and R<SUP>2 </SUP>may especially be phenyl or substituted phenyl. |