PHOTOSENSITIVE RESIN COMPOSITION, PHOTOSENSITIVE ELEMENT, METHOD FOR MANUFACTURING RESIST PATTERN AND METHOD FOR MANUFACTURING PRINTED WIRING BOARD

摘要

PROBLEM TO BE SOLVED: To provide a photosensitive resin composition excellent in chemical resistance (plating resistance), adhesion property, mechanical strength and flexibility and to provide a photosensitive element, a method for manufacturing a resist pattern and a method for manufacturing a printed wiring board by using the above composition. SOLUTION: The photosensitive resin composition contains (A) a binder polymer, (B) a photopolymerization initiator and (C) a photopolymerizable compound having at least one polymerizable ethylenic unsaturated group in the molecule. The (C) component contains a compound having at least one urethane bond in the molecule and a polyalkylene glycol di(meth)acrylate compound having at least two kinds of alkylene oxide groups in the molecule. The composition is used for the photosensitive element and for the method for manufacturing a resist pattern. The method for manufacturing a printed circuit board features that the substrate for the formation of circuits having a resist pattern produced by the above method for manufacturing a resist pattern is etched or plated.