发明名称 ADHESIVE COMPOSITION
摘要 PROBLEM TO BE SOLVED: To provide an adhesive composition having high adhesion strength, excellent durability, waterproof property, hot water resistant adhesive property, etc., having a long usable time to improve working property and also being a low formaldehyde diffusion type. SOLUTION: This adhesive composition contains (A) a synthetic resin emulsion obtained by performing an emulsion polymerization of a radical- polymerizable unsaturated monomer containing at least 1 kind of a primary hydroxy group-containing ethylenically unsaturated monomer as an essential component by using a polysaccharide as a protective colloid, and (B) a water soluble resol type phenol resin, and containing 5-120 pts.wt. solid portion of the (B) component based on 100 pts.wt. solid portion of the (A) component.
申请公布号 JP2003105301(A) 申请公布日期 2003.04.09
申请号 JP20010297449 申请日期 2001.09.27
申请人 SHOWA HIGHPOLYMER CO LTD 发明人 TAKIMOTO SHINICHI;MISE TSUYOSHI;NISHIIKE HARUKI
分类号 C09J157/10;C09J105/00;C09J133/14;C09J161/10;(IPC1-7):C09J157/10 主分类号 C09J157/10
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