发明名称 Design package for temperature-controlled packaging
摘要 The temperature enclosed package, in one embodiment, has a reflector for surrounding the product, a frame with a cavity placed around the reflector, an insulating enclosure placed around the frame, and a diaphragm placed around the insulating enclosure. A vacuum is produced within the temperature controlled package.
申请公布号 US6543491(B1) 申请公布日期 2003.04.08
申请号 US20000705090 申请日期 2000.11.02
申请人 CHUNG JING-YAU 发明人 CHUNG JING-YAU
分类号 B65D81/18;B65D81/20;(IPC1-7):B65B31/04 主分类号 B65D81/18
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