| 摘要 |
PROBLEM TO BE SOLVED: To realize an imaging unit for an endoscope which is easy to connect when connecting a plurality of signal wires to the external lead and the circuit substrate of a solid state image pickup device and which improves the reliability of the connection part. SOLUTION: The imaging unit 18 has the circuit substrate 50 arranged in parallel to a CCD bare chip 37 in rear of the CCD bare chip 37. This circuit substrate 50 is provided with a side through hole soldering land 54 obtained by notching semi-cylindrically on this side face. In rear of the circuit substrate 50, a signal line connection substrate 55 is arranged to be in parallel to the CCD bare chip 37. At this signal line connection substrate 55, a semi-cylindrical side through hole soldering land 56 is provided at a position opposing the external lead 40 of a solid state image pickup device 36 like the circuit substrate 50. In the vicinity of the center of the signal line connection substrate 55, a hole-state through hole land 57 is provided.
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