Enhanced module kick-out spring mechanism for removable small form factor optical transceivers

摘要

A spring-to-spring engagement of a kick-out spring and a secondary spring is disposed intermediate a structure supporting an electrical connector and an insertable and latchable electronic module or the like to enhance the disconnection and ejection of the module from the connector to which the module is connected. The spring-to-spring engagement insures both that adequate spring force is stored upon insertion and connection of the module and that disconnection and ejection forces are applied to the module. The forces are applied over a sufficient distance to fully displace the module from its latched position to its position of disconnection from the connectors and still provide spring force travel of the module to eject at least partially the module from the receiver or port into which the module was inserted and connected. A side benefit of the arrangement is that a high force is exerted on the module once it is unlatched for removal, and this high force will displace the module adequately to insure that the latch of the module does not relatch and to prevent removal of the module.