发明名称 Multi-layer line interfacial connector using shielded patch elements
摘要 This triplate line interfacial connector electrically connects a first triplate line comprised of a first grounding conductor, first dielectric, first power feeding substrate, second dielectric and second grounding conductor, and a second triplate line comprised of a second grounding conductor, third dielectric, second power feeding substrate, fourth dielectric, and third grounding conductor. A patch pattern is formed at a connecting terminal portion of each power feeding line. Two shield spacers each having a through portion around the patch pattern are provided. A first slot is formed at a connecting position between the two triplate lines in the second grounding conductor.
申请公布号 US6545572(B1) 申请公布日期 2003.04.08
申请号 US20000657102 申请日期 2000.09.07
申请人 HITACHI CHEMICAL CO., LTD. 发明人 OHTA MASAHIKO;HIRAO MITSURU;MIZUGAKI HISAYOSHI;MICHISAKA TAKAO;KANAMARU KIICHI
分类号 H01P5/18;(IPC1-7):H01P5/02 主分类号 H01P5/18
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