| 摘要 |
Methods and apparatus for mounting a semiconductor to a heat sink. A clamp is provided comprising a spring beam mounted to a clamp body, wherein the body restricts the spring beam ends and the spring beam has a convex curvature relative to an adjacent power semiconductive module. The portion of the spring beam near its apex contacts the module, applying force to bias a heat-transmitting surface of the module against a heat sink. When temperature increases, the spring beam expands to add additional clamping force to the module. Further embodiments provide making the spring beam from a material having a high coefficient of thermal expansion and the clamp body from a material having a low coefficient of thermal expansion, further increasing the force that may be applied by the spring beam with increases in temperature. The spring beam may comprise layers of different materials to increase the applied force.
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