METHOD FOR CUTTING NONMETALLIC SUBSTRATE

摘要

PURPOSE: A method for cutting a nonmetallic substrate is provided to improve speed of cutting and quality of cutting surface by optimizing shape and arrangement of an energy source for rapidly heating the nonmetallic substrate. CONSTITUTION: The method for cutting a nonmetallic substrate comprises steps of (i) rapidly heating the cutting path by irradiating first laser beam(210) on a cutting path set on the nonmetallic substrate(1) in an oval shape in which a ratio of major axis (Bl) to minor axis (Bw) is adjusted in the range of 40:1 to 80:1; (ii) forming a groove shaped scribe line(1c) on the surface of the nonmetallic substrate by thermal shock formed by spraying a cooling fluid(310) onto the cutting path; and (iii) cutting the nonmetallic substrate by scanning second laser beam(510) along a scanning path of the first laser beam, wherein the first laser beam is formed in a symmetrical shape centering around the major and minor axes, wherein the first laser beam is formed in a symmetrical shape centering around the major axis while it is formed in an asymmetrical shaped centering around the minor axis, and wherein length (Sw) of the minor axis is 1 to 2 mm while length (Sl) of the major axis is 40 to 80 mm.