SOLDERING METHOD AND SOLDERING DEVICE USING THE SAME

摘要

PROBLEM TO BE SOLVED: To improve reliability of soldering with respect to a soldering method and soldering device using the same method. SOLUTION: The surface of the molten solder 2 inside the soldering bath 1 is swept by a braided spatula 4 and next, a soldering section 3a is dipped inside the solder 2 from the soldering 2 surface after sweeping with the spatula 4 and is raised, then, outside the molten solder 2.