发明名称 |
METHOD FOR FORMING FILM BODY |
摘要 |
PROBLEM TO BE SOLVED: To provide a method for forming a film body with excellent smoothness, impact resistance and peeling off resistance even in the case of a relatively thin film. SOLUTION: The method for forming a film body has a step (1) providing a plurality of bores on a surface of a base material; a step (2) for filling a solventless system two-liquid polyurea curable resin (A) in the bores 2 provided; a step (3) for laying a reinforcing material on the surface of the base material after filling it in the bore; and a step (4) for filling and coating the solventless system two-liquid polyurea curable resin (A) in a range of thickness until the reinforcing material can be buried from the surface of the base material; or further a step (5) for two-liquid collision mixing spray-coating a solventless two-liquid super-high speed curable resin (B) on the film body obtained in the step (4) and curing it.
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申请公布号 |
JP2003103217(A) |
申请公布日期 |
2003.04.08 |
申请号 |
JP20010302506 |
申请日期 |
2001.09.28 |
申请人 |
SUNRISE ENGINEERING KK |
发明人 |
YAMAMOTO SHUHEI;HARIMA TSUTOMU;ISHIBASHI SHINTARO |
分类号 |
B05D7/00;B05D1/36;B05D3/02;B05D7/24;B32B27/42;(IPC1-7):B05D7/00 |
主分类号 |
B05D7/00 |
代理机构 |
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代理人 |
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主权项 |
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地址 |
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