发明名称 METHOD FOR FORMING FILM BODY
摘要 PROBLEM TO BE SOLVED: To provide a method for forming a film body with excellent smoothness, impact resistance and peeling off resistance even in the case of a relatively thin film. SOLUTION: The method for forming a film body has a step (1) providing a plurality of bores on a surface of a base material; a step (2) for filling a solventless system two-liquid polyurea curable resin (A) in the bores 2 provided; a step (3) for laying a reinforcing material on the surface of the base material after filling it in the bore; and a step (4) for filling and coating the solventless system two-liquid polyurea curable resin (A) in a range of thickness until the reinforcing material can be buried from the surface of the base material; or further a step (5) for two-liquid collision mixing spray-coating a solventless two-liquid super-high speed curable resin (B) on the film body obtained in the step (4) and curing it.
申请公布号 JP2003103217(A) 申请公布日期 2003.04.08
申请号 JP20010302506 申请日期 2001.09.28
申请人 SUNRISE ENGINEERING KK 发明人 YAMAMOTO SHUHEI;HARIMA TSUTOMU;ISHIBASHI SHINTARO
分类号 B05D7/00;B05D1/36;B05D3/02;B05D7/24;B32B27/42;(IPC1-7):B05D7/00 主分类号 B05D7/00
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