| 摘要 |
<p>PURPOSE: A semiconductor package is provided to prevent a water absorption and a surface separation between a die paddle and a molding part by increasing a bonding power with the molding part and simultaneously maximizing the surface between the die paddle and the molding part. CONSTITUTION: A semiconductor package comprises a die paddle(2), a semiconductor chip(6) having a number of pads(6a) sticked to the die paddle(2) using an adhesive(4), a number of leads(8) on both sides of the semiconductor chip(6), conductive wires(10) connecting the leads(8) with the pads(6a), and a molding part(12) molding the resultant structure. The die paddle(2) further includes protruding lines(2a) contacted with the molding part(12), and depressed lines(2b), thereby increasing the surface of the paddle(2) and the molding part(12).</p> |
